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Design, Cost, and Performance Trade-Offs The HDI structure is cost-effective for higher-density assemblies shown throughout this chapter. The relative price of HDI versus relative density is depicted in Fig. 22.2. Cost parity (for similar wiring densities) is achieved with a four-layer HDI microvia at approximately an eight-layer, through-hole printed circuit multilayer. Wiring capacities and densities greater than an eightlayer multilayer can be achieved at a lower price with a properly designed HDI substrate.At very high densities, there are no through-hole multilayers that can meet the wiring capacities and density demand necessary, whereas HDI can easily meet the requirements.

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FIGURE 22.2 Relative price and density comparison between conventional throughhole (TH) boards and HDI microvia boards with different structures. The relative cost index (RCI) is actual production pricing of boards normalized to the eight-layer price. The density (DEN) is a measure of the maximum average pins (leads) per sq. in. (for both sides of the PCB). The diagonal lines are equivalent density boards. These are for FR-4 printed circuits.

Specifications and Standards The Institute for Interconnecting and Packaging Electronic Circuits (IPC) has been working on standards and specifications for high-density interconnecting structures. Three standards and a guideline are the documents that are available from the IPC. The four documents are:

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IPC-2315 Design Guide for High Density Interconnecting Structures and Microvias IPC-2226 Design Standard for High Density Interconnecting Structures and Microvias IPC-4104 Standard for Qualification and Conformance of Materials for High Density Interconnection Structures and Microvias IPC-6016 Standard for Qualification and Performance Specification for High Density Interconnection Structures The IPC standards that cover HDI design rules, materials, and specifications are:

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IPC-2226 This specification educates users in microvia formation, selection of wiring density, selection of design rules, interconnecting structures, and material characterization. It is intended to provide standards for use in the design of printed circuit boards utilizing microvia technologies. IPC-4104 This standard identifies materials used for high-density interconnection structures. A series of specifications (slash sheets) are defined for specific available materials. Each sheet outlines engineering and performance data for materials used to fabricate highdensity interconnecting structures. These materials include dielectric insulator, conductor, and dielectric/conductor combinations. The slash sheets are provided with letters and numbers for identification purposes. For example, if a user wishes to order from a vendor and reference the specification sheet number 1, the number 1 would be substituted for the S

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in the preceding designation example (IPC-4104/1). To start the ordering process, one can use the slash sheets in the IPC-4104 document in combination with relevant IPC documents for each material sets (e.g., IPC-CF-148, IPC-MF-150, IPC-4101, IPC-4102, IPC-4103, etc.). IPC-6016 This document contains the general specifications for high-density substrates not already covered by other IPC documents.

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The IPC HDI Structure Subcommittee, which is responsible for defining performance requirements, used the following methodology to specify HDI products. Since a microvia can be any shape including straight wall, positive or negative taper, or cup determining the methods used for producing microvias can be segmented into three methodologies (A, B, or C), as noted in Table 22.1.

TABLE 22 .1 Ten Process Methods Utilized to Produce Microvias Hole formation Mechanically drilled Dry-etched (plasma) Mechanically punched Abrasive blast Laser-drilled Post-pierced Photo-formed Insulation displacement Wet-etched Conductive bonding sheets Microvia process* A A A A A B A B, C A C

* A: create hole, then make conductive; B: create conductive via, then add dielectric; C: create conductive via and dielectric simultaneously.

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All of these technologies provide approximately the same high-density design rules. These design rules endow build-up technologies with four to eight times the wiring density of conventional, all-drilled through-hole vias. The ten via profiles are depicted in Fig. 22.3.

The structure of the high-density interconnection is by type:Type I,Type II,Type III,Type IV, Type V, and Type VI (see Table 22.2). However, some of these type constructions are based on which microvia material is to be used. Thus, the following definition applies to all high-density interconnect substrates (HDIS).

TABLE 22.2 Description of the 6 IPC HDI Type Structures of IPC-2226 Type I Type II Type III Type IV Type V Type VI 1[C]0 or 1[C]1, with through-vias from surface to surface 1[C]0 or 1[C]1, with through-vias buried in the core and from surface to surface 2[C] 0, 2 or more HDI layers added to through-via in core or from surface to surface 2[P] 0 where P is a passive substrate with no electrical connecting functions Coreless construction using layer pairs Alternate construction using conductive pastes

[C], printed circuit core; [P], passive substrate core; 0, 1, and 2, number of build-up layers on each side of the core [C] or [P].

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