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The temperature at which a 5 percent weight loss of the sample is detected is defined as the Td Although this test methodology is a good gauge of the thermal stability of laminate materials, the method and results must be evaluated carefully to ensure that correct conclusions are drawn from the results For example, the results of this test are dependent on the surface/ volume ratio of the specimen in test-specimens of the same weight, but different surface areas will show different results The sample with the large surface area loses weight at a faster rate and therefore shows a lower Td Samples with a large percentage of nondecomposing filler or reinforcement material will also behave differently as the measured weight change is based only on the resin content of the sample This again will lead to a seemingly higher measured Td, which may lead to erroneous conclusions.

Finally, the process of decomposition is as important as the determined value of Td and a comparison of the onset of weight loss may also be a valuable parameter to assess when comparing laminate materials using this methodology In general, a higher Td value is desirable for materials that are being selected for lead-free assembly processes as this indicates that the laminate withstands the higher assembly temperatures with an increased margin Figure 122 shows an example of different Td measurements for three different laminate materials It shows the typical decomposition rates for some sample materials and also highlights how the assessment of a material can change if different criteria are chosen If the IPC value of 5 percent weight loss is chosen, then M3 is superior to M1 and M2.

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Taniguchi s table for various products [2] categorized by the authors (Venkatesh and Izman) into achievable ISO tolerance bands with surface finish

But if the materials engineer decides that the onset of weight loss (decomposition) is critical for the application, then M3 is the worst performing material The authors recommend using materials with a high onset temperature as well as a high 5 percent decomposition temperature..

Size and pitch of components are smaller while the number of I/Os is increasing. Smaller geometries allow faster transmission of signals and reduce signal crossing delay.

At the same time, enhanced performance is required for faster signal rise times, reduced parasitics, reduction of radio frequency interference (RFI) and electromagnetic interference (EMI), fewer layers, and improved high-temperature performance and reliability. HDI provides all of these advantages and more. 22.2.3 HDI Traditional PCB Comparison The interactions among printed circuit boards, components, and assemblies are best seen by the packaging technology map (see Chap. 2; Fig. 2.2). Components are characterized by the average I/Os per part, assemblies by the components per sq. cm and I/Os per sq. cm, and the printed circuit by its wiring density in cm per sq. cm. Fig. 22.1 shows the approximate crossover between the traditional printed circuit board and the next generation with microvias.4

FIGURE 22.1 The through-hole density barrier. If the ends of an electrical net contain an SMT pad connected by a trace and a via hole, then there is only so many such connections (using conventional design rules spacing) that can be placed in any square area. This through-hole barrier is shown crossing this technology roadmap. To cross the barrier (and prevent via starvation), the fabricator must stack vias using blind and buried vias and such.

Tolerance band 200 m Mechanical Electronic Optical Surface finish, Ra m Shaping 125 16 Milling 63 08 Reaming 32 08 Turning 63 04 Drilling 63 08 Boring 63 04 Laser 63 08 ECM 32 02 Grinding 32 01 ELID 06 02 Honing 08 01 ISO IT Tolerance grade IT10 IT9 IT5 IT6 IT9 IT6

independently. The hardware development can go on in parallel, and you enter a phase that could be termed as test-and-debug phase. This is an iterative phase that continues till all your subroutines and hardware work as required. To complete this phase, you must take the help of as much test equipment and development tools (such as a programmer and an emulator) as possible to minimize the number of iterations. A realistic development system is illustrated in Figure 2.4. 9. Finally, you must integrate all the software and the hardware and test again. You again enter the test-and-debug phase till everything works as required. 10. During the writing of the software and building the hardware, an important activity that should not be missed is documentation. Documenting the design is extremely important not only for maintaining a record of your work, but also for testing during device lifetime and future revisions. 11. The final stage involves deploying the system in the target environment or the appropriate production line.

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